5CSXFC6C6U23A7N vs 5CSEBA6U23A7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 5CSXFC6C6U23A7N disebabkan oleh Intel dan 5CSEBA6U23A7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 5CSXFC6C6U23A7N | 5CSEBA6U23A7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V SX SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 | 110,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Embedded Memory (M20K) | 5,140 Kbit | — |
| DSP Blocks (18x18) | 224 | — |
| Maximum User I/O | 364 LVDS-capable pins | — |
| Transceivers | 6 (up to 3.125 Gbps) | — |
| Kemasan | 672-pin UBGAFBGA (23 x 23 mm) | 672-UBGA (23x23 mm) |
| Process Technology | TSMC 28 nm Low Power | — |
| Core Voltage | 1.1 V | 1.1 V |
| Hard Memory Controller | DDR2 / DDR3 / LPDDR2 with ECC | — |
| HPS Clock Frequency | Up to 925 MHz (per Cyclone V device datasheet) | 700 MHz |
| Suhu Operasi | Automotive grade (per part number decode A) | -40C to +85C (industrial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (per Intel product page) | RoHS compliant |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Process Node | — | 28 nm low-power |
| Hard Processor System (HPS) | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Automotive Qualification | — | AEC-Q100 compliant |
| DSP Blocks | — | Variable-precision DSP blocks (per family datasheet) |
| Memory Interfaces | — | DDR3/DDR3L controller in HPS |
| Shipping Media | — | Tray |