A3P1000-2FG256M vs A3P1000-1FGG256M Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P1000-2FG256M disebabkan oleh Microchip Technology dan A3P1000-1FGG256M disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip
A3P1000-2FG256M ✓ AktifMicrochip Technology
A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip
A3P1000-1FGG256M ✓ AktifPengandingan Spesifikasi
| Parametr | A3P1000-2FG256M | A3P1000-1FGG256M |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3 | ProASIC3 |
| Logic Elements | 11000 LE | 11000 LE |
| Number of I/Os | 177 I/O | — |
| System Frequency | 310 MHz | — |
| Technology | 130 nm CMOS, flash-based | — |
| Tegangan Pemberi Arus Operasi | 1.5 V | 1.5 V |
| Speed Grade | 2 | -1 |
| Kemasan / Case | FBGA-256 (256-LBGA) | — |
| Gaya Pemasangan | SMD/SMT | SMD/SMT |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +85 C | — |
| Packaging | Tray | Tray |
| Programmability | Reprogrammable, non-volatile flash | In-system reprogrammable |
| I/O Banks | 4 banks (banked VCCIB) | 4 |
| Configuration | Single-chip, instant-on (no external config PROM) | — |
| Series | A3P1000 | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| System Gates | — | 1000000 |
| User I/O | — | 177 |
| Embedded RAM | — | 147456 bits |
| Core Supply Voltage | — | 1.5 V |
| Configuration Memory | — | Flash (nonvolatile, single chip) |
| Suhu Operasi | — | 0C to +85C |
| Kemasan | — | 256-LBGA (FBGA-256) |
| Product Series | — | A3P1000 |
| Number of Gates | — | 1000000 |