A3P600-FG484I vs A3P600-FGG484 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P600-FG484I disebabkan oleh Microchip Technology dan A3P600-FGG484 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | A3P600-FG484I | A3P600-FGG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600K |
| Maximum Frequency | 231 MHz | — |
| Technology | 130nm Flash | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/Os | 235 | — |
| Kemasan | 484-FBGA | 484-Pin FBGA (FGG484) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +100C | — |
| Configuration | Flash-based, non-volatile | — |
| PLLs | 6 | — |
| Flash Memory | 128K bits | — |
| I/O Standards | LVCMOS, LVTTL, differential | — |
| Status RoHS | Compliant | Lead Free |
| Lifecycle | Active | — |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm CMOS |
| User I/O Count | — | 235 |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |