A3P600-FGG256I vs A3P600-FG256 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P600-FGG256I disebabkan oleh Microchip Technology dan A3P600-FG256 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3P600-FGG256I - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-FGG256I ✓ AktifMicrochip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ AktifPengandingan Spesifikasi
| Parametr | A3P600-FGG256I | A3P600-FG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3 | ProASIC3 (Flash FPGAs) |
| System Gates | 600K | 600000 |
| Logic Elements (D-Registers) | 13824 | — |
| Embedded RAM | 110592 bits | — |
| User I/O | 177 | 177 |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V (1.5 V nominal) |
| I/O Banks | 4 | 4 (independent VCCIBx supplies) |
| Configuration Technology | Flash (nonvolatile, single-chip) | On-chip flash, reprogrammable, single-chip |
| Suhu Operasi | -40C to +85C | 0 C to 85 C (TJ) |
| Kemasan | 256-Ball FBGA (FGG256) | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Lead-Free | Yes | — |
| Status RoHS | Compliant | RoHS non-compliant (per Microchip USA listing) |
| Typical Applications | Signal processing, industrial automation, communications, hardware acceleration | — |
| Logic Elements | — | 7K LEs (VersaTiles) |
| Embedded SRAM | — | 110592 bits (True Dual-Port) |
| Maximum System Performance | — | Approx. 231 MHz |
| Power-Up Behavior | — | Instant On Level 0 support |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |