A3PE3000-1FGG324I vs A3PE3000L-FGG324I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000-1FGG324I disebabkan oleh Microchip Technology dan A3PE3000L-FGG324I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG324I ✓ AktifMicrochip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000-1FGG324I | A3PE3000L-FGG324I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E (Flash-based FPGA) | ProASIC3L (Flash FPGA) |
| System Gates | 3,000,000 | 3,000,000 |
| User I/Os (this package) | 221 | — |
| Max User I/Os (family) | 616 | — |
| Embedded SRAM | 504 kbits true dual-port | — |
| Supply Voltage (core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm CMOS |
| Configuration | Flash-based, Live-at-Power-Up Level 0, single-chip | Single-chip, no external boot PROM |
| Soft CPU Support | Optional soft ARM support | — |
| Kemasan | 324-BGA FBGA (19x19 mm, 1 mm pitch) | 324-BGA FBGA (19x19 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount (SMD) |
| Suhu Operasi | -40C to +100C (TJ) | -40C to +100C (industrial) |
| Number of Gates | 3,000,000 | — |
| Speed Grade | -1 | — |
| Packaging | Tray | Tray |
| Status RoHS | ROHS3 Compliant | RoHS Compliant |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | — |
| Total RAM Bits | — | 516096 |
| User I/O | — | 221 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Lead Free Status | — | Lead Free |
| Number of Package Balls | — | 324 |