A3PE3000-FGG484 vs A3PE3000-FG484 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000-FGG484 disebabkan oleh Microchip Technology dan A3PE3000-FG484 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Microchip Technology
A3PE3000-FGG484 A3PE3000-FGG484 - ProASIC3E FPGA 3M Gates 484-BGA | Microchip

A3PE3000-FGG484 - ProASIC3E FPGA 3M Gates 484-BGA | Microchip

A3PE3000-FGG484 ✓ Aktif
Microchip Technology
A3PE3000-FG484 A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

A3PE3000-FG484 ✓ Aktif

Pengandingan Spesifikasi

Parametr A3PE3000-FGG484 A3PE3000-FG484
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family ProASIC3E ProASIC3E Flash FPGA
System Gates 3000000 gates 3000000
Logic Cells 75264 —
User I/O 341 341
Total RAM Bits 516096 —
Maximum Operating Frequency 231 MHz —
Process Technology 130 nm CMOS 130 nm flash CMOS
Core Supply Voltage 1.5 V —
Program Memory Type Flash (non-volatile) —
Jenis Pemasangan Surface Mount Surface Mount
Kemasan 484-BGA (FBGA-484), 23 x 23 mm, 1 mm pitch, 2.23 mm height 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height
Suhu Operasi [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Speed Grade [DATA_NEEDED: speed grade code] —
Status RoHS RoHS Compliant (FGG lead-free variant) G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info)
Supplier Device Package 484-FBGA —
Programming Support Microchip Libero SoC design suite —
Logic Cells (DFEs) — 75264
Core Voltage — 1.5 V
System Frequency — 231 MHz
Configuration Memory — On-chip flash (non-volatile, single-chip)
Soft CPU Support — Optional soft ARM support
Differential I/O Standards — LVDS, LVPECL
Footprint Compatibility — FG256 and FG484 footprint-compatible
Packaging — Tray
Embedded Memory — [DATA_NEEDED: embedded block RAM capacity]

Laporan Datasheet & Sumber

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