A3PE3000-PQG208 vs A3PE3000L-1PQG208 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000-PQG208 disebabkan oleh Microchip Technology dan A3PE3000L-1PQG208 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000-PQG208 - ProASIC3E 3M-Gate Flash FPGA, 208-PQFP | Microchip
A3PE3000-PQG208 ✓ AktifMicrochip Technology
A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip
A3PE3000L-1PQG208 ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000-PQG208 | A3PE3000L-1PQG208 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E (ProASIC3 Flash Family) | ProASIC3L (ProASIC3E family, low power) |
| System Gates | 3000000 gates (3M) | 3000000 |
| Logic Cells (CLBs) | 75264 | — |
| Embedded Memory | 516096 bits | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS (flash-based) | 130 nm flash |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| PLLs | 2 (supported in PQ208 package) | — |
| Clock Conditioning Circuits (CCC) | 6 | — |
| Global Clock Networks | 6 chip (main) plus 3 quadrant | — |
| Soft Processor Support | ARM Cortex-M1 32-bit | — |
| Kemasan | 208-Pin PQFP (PQG208 / 208-BFQFP) | 208-BFQFP (PQFP-208) |
| Package Dimensions | 28 x 28 mm, 3.4 mm height, 0.5 mm pitch | — |
| Jenis Pemasangan | Surface Mount | — |
| Lead Free | Yes | Yes (G suffix) |
| Status RoHS | Compliant (green package) | [DATA_NEEDED: RoHS compliance status] |
| Reprogrammability | Yes (in-system reprogrammable flash) | — |
| Manufacturer Part Number | — | A3PE3000L-1PQG208 |
| Logic Elements | — | 35K LEs |
| Number of I/O | — | 147 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Tegangan Pemberi Arus Operasi | — | 1.5 V |
| Maximum Operating Frequency | — | 892.86 MHz |
| Configuration Memory | — | Flash (single-chip, reprogrammable) |
| Low Power Feature | — | Flash*Freeze technology (40% dynamic / 50% static power reduction) |
| Gaya Pemasangan | — | SMD/SMT |
| Gambaran Suhu Operasi | — | 0C to +70C |
| Packaging | — | Tray |