A3PE3000L-1FGG324 vs A3PE3000L-FGG324I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-1FGG324 disebabkan oleh Microchip Technology dan A3PE3000L-FGG324I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG324 ✓ AktifMicrochip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000L-1FGG324 | A3PE3000L-FGG324I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Elements | 35K LEs | — |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Technology | Nonvolatile Flash (Instant On) | — |
| Kemasan | 324-ball FBGA (FGG324) | 324-BGA FBGA (19x19 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount (SMD) |
| Speed Grade | -1 | — |
| Special Features | Flash*Freeze low-power technology | — |
| Reprogrammability | Yes (in-system reprogrammable flash) | — |
| Configuration | Single-chip, no external configuration device required | Single-chip, no external boot PROM |
| Lead Free Status | Lead Free | Lead Free |
| Status RoHS | RoHS Compliant | RoHS Compliant |
| Suhu Operasi | [DATA_NEEDED: Operating Temperature Range] | -40C to +100C (industrial) |
| Max Fabric Frequency | [DATA_NEEDED: Maximum Fabric Frequency] | — |
| Total RAM Bits | — | 516096 |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Packaging | — | Tray |
| Number of Package Balls | — | 324 |