A3PE3000L-FGG324I vs A3PE3000L-1FGG324 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FGG324I disebabkan oleh Microchip Technology dan A3PE3000L-1FGG324 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ AktifMicrochip Technology
A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG324 ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000L-FGG324I | A3PE3000L-1FGG324 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 | 3000000 |
| Total RAM Bits | 516096 | — |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS flash |
| Kemasan | 324-BGA FBGA (19x19 mm) | 324-ball FBGA (FGG324) |
| Jenis Pemasangan | Surface Mount (SMD) | Surface Mount |
| Suhu Operasi | -40C to +100C (industrial) | [DATA_NEEDED: Operating Temperature Range] |
| Technology Features | Nonvolatile Flash, Instant On, Flash*Freeze | — |
| Configuration | Single-chip, no external boot PROM | Single-chip, no external configuration device required |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | Lead Free |
| Status RoHS | RoHS Compliant | RoHS Compliant |
| Number of Package Balls | 324 | — |
| Logic Elements | — | 35K LEs |
| Logic Cells (CLBs) | — | 75264 |
| Technology | — | Nonvolatile Flash (Instant On) |
| Speed Grade | — | -1 |
| Special Features | — | Flash*Freeze low-power technology |
| Reprogrammability | — | Yes (in-system reprogrammable flash) |
| Max Fabric Frequency | — | [DATA_NEEDED: Maximum Fabric Frequency] |