A3PE600-1FG256 vs A3PE600-1FGG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE600-1FG256 disebabkan oleh Microchip Technology dan A3PE600-1FGG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE600-1FG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-1FG256 ✓ AktifMicrochip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE600-1FG256 | A3PE600-1FGG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E | ProASIC3E |
| System Gates | 600000 | 600000 |
| Configuration Cells | 110592 | — |
| User I/Os (this package) | 165 | — |
| Maximum User I/Os (family) | 616 | — |
| Embedded SRAM | up to 504 kbits True Dual-Port | 110592 bits (up to 504 kbits family density) |
| Maximum System Frequency | 272 MHz | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V (1.5 V nominal) |
| Configuration Memory | On-chip Flash, Live-At-Power-Up Level 0 | On-chip Flash (Live at Power-Up, Level 0) |
| Kemasan | 256-LBGA / FBGA-256, 1 mm pitch | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Suhu Operasi | 0 to 70 C | -40C to +100C (TJ), industrial |
| Logic Family | CMOS | CMOS |
| Soft Processor Support | Optional Soft ARM (Cortex-M1 class) | — |
| Single-Chip Solution | Yes (no external configuration device) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Speed Grade | -1 | -1 |
| Status RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS compliance status] |
| Logic Cells | — | 13824 |
| User I/O | — | 165 |
| Maximum System Performance | — | 272 MHz |
| Reprogrammability | — | Yes (single-chip, no external boot PROM) |
| Typical Application Domains | — | Industrial, communications, medical, aerospace/defense |