A3PE600-1FGG256 vs A3PE600-FGG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE600-1FGG256 disebabkan oleh Microchip Technology dan A3PE600-FGG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-1FGG256 ✓ AktifMicrochip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE600-1FGG256 | A3PE600-FGG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E | ProASIC3E Flash FPGA |
| System Gates | 600000 | 600000 gates |
| Logic Elements | 7K LEs | — |
| User I/O | 165 | 165 |
| Registers | 110592 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum System Frequency | 272 MHz | — |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS | CMOS flash FPGA |
| Configuration Memory | On-chip flash (single-chip, live-at-power-up) | On-chip Flash (non-volatile, single-chip) |
| Speed Grade | -1 | — |
| Suhu Operasi | 0 C to +70 C | -40C to +85C (Industrial) |
| Kemasan | 256-LBGA (FBGA-256, 1 mm ball pitch) | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM | — |
| Power-Up Support | Live-At-Power-Up Level 0 | — |
| Reprogrammability | Yes (flash-based, in-system reprogrammable) | — |
| Logic Elements (VersaTiles) | — | 13824 |
| Embedded Flash Memory | — | 110592 bits |
| Maximum Internal Performance | — | 350 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 1.6 mm |
| Status RoHS | — | Compliant (lead free) |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible packages |