A54SX32-2BGG329I vs A54SX32-BGG329 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A54SX32-2BGG329I disebabkan oleh Microchip Technology dan A54SX32-BGG329 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A54SX32-2BGG329I - SX FPGA 48K Gates 329-BGA | Microchip
A54SX32-2BGG329I ✓ AktifMicrochip Technology
A54SX32-BGG329 - 32K Gate SX FPGA, 240MHz, 329-BGA | Microchip
A54SX32-BGG329 ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | A54SX32-2BGG329I | A54SX32-BGG329 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Family | SX (Actel/Microsemi SX FPGA) | — |
| System Gates | 48000 | 32000 gates |
| Equivalent Gates | 32000 | — |
| Logic Cells | 1800 | 2880 |
| Number of I/O | 249 | — |
| Frekuensi Klock Maksimum | 320 MHz | — |
| Process Technology | 0.35 um CMOS | 0.35 um CMOS |
| Tegangan Pemberi Arus | 3.3 V / 5 V | 3.3 V / 5 V |
| Programming Technology | Antifuse (one-time programmable, nonvolatile) | Antifuse (one-time programmable) |
| Speed Grade | -2 | — |
| Suhu Operasi | -40C to +85C (Industrial, suffix I) | — |
| Kemasan | 329-ball BGA (329-BBGA), 31 x 31 x 2.59 mm | 329-BBGA (31 x 31 mm) |
| Ball Pitch | 1.27 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | RoHS Compliant | ROHS COMPLIANT |
| Lead Free Status | Lead Free | — |
| Packaging | Tray | — |
| User I/O | — | 249 |
| Maximum Internal Frequency | — | 240 MHz |
| Clock-to-Out (Pin-to-Pin) | — | 3.7 ns |
| Input Setup Time | — | 0.1 ns |
| Clock Skew | — | 0.25 ns |
| Architecture | — | Sea-of-modules (Actel SX family) |
| Package Ball Pitch | — | 1.27 mm |
| Logic Family | — | CMOS |
| PCI Integration | — | 66 MHz PCI single-chip solution |
| ECCN | — | 3A991.d.2 |