ATSAM3N2BA-MU vs ATSAM4LS2BA-MU Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci ATSAM3N2BA-MU disebabkan oleh Microchip Technology dan ATSAM4LS2BA-MU disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
ATSAM3N2BA-MU - 48MHz Cortex-M3 MCU, 128KB Flash | Microchip
ATSAM3N2BA-MU ✓ AktifMicrochip Technology
ATSAM4LS2BA-MU - 48MHz Cortex-M4 MCU 128KB Flash | Microchip
ATSAM4LS2BA-MU ✓ AktifPengandingan Spesifikasi
| Parametr | ATSAM3N2BA-MU | ATSAM4LS2BA-MU |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-M3 revision 2.0 | ARM Cortex-M4 |
| Core Size | 32-bit | 32-bit |
| Maximum Clock Speed | 48 MHz | 48 MHz |
| Flash Memory Size | 128KB (128K x 8) | — |
| SRAM Size | 16K x 8 | — |
| Supply Voltage Range | 1.62 V to 3.6 V | — |
| Number of I/O | 47 | — |
| Kemasan / Case | 64-QFN (9x9 mm) with exposed pad | — |
| Oscillator Type | Internal | — |
| Peripherals | PWM timer, RTC, 10-bit ADC, DMA | — |
| Connectivity | 2x USART, 2x UART, 2x TWI, 3x SPI | — |
| Timers | 6x general-purpose 16-bit timers | — |
| Instruction Set | Thumb-2 | — |
| Temperature Grade | Industrial | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Series | SAM3N | SAM4L |
| Compatibility | Pin-to-pin compatible with SAM3S series (48/64/100-pin) and SAM7S legacy products (48/64-pin) | — |
| Status RoHS | Compliant (green package) | Green / RoHS compliant per Mouser listing |
| Flash Memory | — | 128KB (128K x 8) |
| SRAM | — | 32KB |
| Tegangan Pemberi Arus | — | 1.8V / 3.3V |
| Bilangan Pin | — | 64 |
| Kemasan | — | 64-VQFN (9x9 mm) Exposed Pad |
| Suhu Operasi | — | Industrial (-40C to +85C) |
| Low Power Technology | — | picoPower |
| Package Code (JEDEC style) | — | HVQCCN, square, no-lead |
| Packaging Method | — | Tray |
| Connectivity Interfaces | — | USART, SPI, I2C (per SAM4L family) |