ATSAME53J19A-MU-EFP vs ATSAME53J19A-MUT Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci ATSAME53J19A-MU-EFP disebabkan oleh Microchip Technology dan ATSAME53J19A-MUT disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
ATSAME53J19A-MU-EFP - ARM Cortex-M4F 120MHz MCU 512KB Flash | Microchip
ATSAME53J19A-MU-EFP ✓ AktifMicrochip Technology
ATSAME53J19A-MUT - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
ATSAME53J19A-MUT ✓ AktifPengandingan Spesifikasi
| Parametr | ATSAME53J19A-MU-EFP | ATSAME53J19A-MUT |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Architecture | ARM Cortex-M4F with FPU and DSP extensions | — |
| Frekuensi Klock Maksimum | 120 MHz | — |
| Program Memory (Flash) | 512 KB (dual-panel, ECC) | — |
| SRAM | 192 KB (ECC) | 192 KB with ECC |
| Kemasan | 64-pin VQFN (9x9 mm) with exposed pad | 64-VQFN (9x9 mm) with exposed pad |
| Operating Voltage Range | 1.71 V to 3.6 V | — |
| Gambaran Suhu Operasi | -40C to +85C (industrial) | — |
| Flash Endurance Grade | Extended Flash Performance (EFP) | — |
| USB Interface | USB 2.0 Full-Speed with on-chip PHY | — |
| Ethernet | 10/100 MAC with 1588 PTP hardware timestamping | 10/100 Ethernet MAC on selected family variants |
| ADC | 12-bit, up to 1 Msps, up to 24 channels | 12-bit, up to 1 Msps (per SAM E53 family datasheet) |
| DAC | Two 12-bit, 1 Msps | — |
| SERCOM | Up to 8 configurable (UART/SPI/I2C) | Configurable UART/SPI/I2C peripherals |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Core | — | ARM Cortex-M4F with FPU |
| Maximum CPU Clock | — | 120 MHz |
| Flash Memory | — | 512 KB (512K x 8) dual-panel with ECC |
| Operating Voltage (VDDIN) | — | 3.3 V typical (see datasheet range) |
| Bilangan Pin | — | 64 |
| Temperature Grade | — | Industrial (per Partstack listing) |
| USB | — | High-speed USB 2.0 (host/device) on chip |
| CAN | — | CAN-FD supported |
| Packing Method | — | Tape & Reel |