EP1C12F324C8 vs EP1C12F324I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1C12F324C8 disebabkan oleh Intel dan EP1C12F324I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1C12F324C8 | EP1C12F324I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone I |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Number of Logic Elements (LEs) | 12060 | — |
| Number of LABs/CLBs | 1206 | — |
| Total Embedded Memory | 239616 bits | — |
| Number of I/O Pins | 249 | — |
| Kemasan | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (FineLine BGA) |
| Core Voltage | 1.5 V | 1.5 V (typ) |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) | — |
| Number of PLLs | 2 | — |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) | — |
| Speed Grade | C8 (commercial, slowest speed bin) | 7 (industrial, performance) |
| Suhu Operasi | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Configuration Method | SRAM-based, external configuration device (EPCS series) | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 12,060 |
| Total RAM Bits | — | 239,616 |
| Embedded Memory Blocks | — | 52 x M4K (4,608 bits each) |
| User I/O Count | — | 249 |
| PLLs | — | 2 |
| Global Clocks | — | 8 |
| I/O Voltage Standards | — | LVTTL, LVCMOS, SSTL, HSTL |
| Package Code Suffix | — | F324 |