EP20K400FC784-2 vs EP20K400FI784-2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K400FC784-2 disebabkan oleh Altera dan EP20K400FI784-2 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP20K400FC784-2 | EP20K400FI784-2 |
|---|---|---|
| Merek | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX 20K | — |
| Device Family Member | EP20K400C | — |
| Typical System Gates | 400,000 | — |
| Maximum User I/O Pins | 488 (784-BGA) | [DATA_NEEDED: user I/O count] |
| Logic Elements | 16,640 | — |
| Embedded RAM (ESB) | 212 Kbits | — |
| Maximum Block RAM | [DATA_NEEDED: block RAM organization per ESB] | — |
| Maximum Frequency (internal) | [DATA_NEEDED: fmax, datasheet-dependent] | — |
| Process Technology | 0.22 µm CMOS SRAM | [DATA_NEEDED: process node] |
| Core Voltage | 2.5 V | — |
| MultiVolt I/O Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT | — |
| Configuration Mode | Serial / Parallel SRAM-volatile (external PROM required) | — |
| Kemasan | 784-Ball FineLine BGA (FC) | — |
| Speed Grade | -2 (industrial) | -2 |
| Suhu Operasi | [DATA_NEEDED: exact Tj range] | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | 3 (per Partstack listing) | [DATA_NEEDED: MSL rating] |
| Peak Reflow Temperature | 220 °C (per Partstack listing) | — |
| Hot Socketing | Supported | — |
| JTAG / Boundary-Scan | IEEE 1149.1 compliant | — |
| Status RoHS | [DATA_NEEDED: not confirmed in provided data] | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | APEX 20K |
| Typical Gates | — | 400,000 |
| Logic Elements (LEs) | — | [DATA_NEEDED: logic elements count] |
| Embedded System Blocks (ESBs) | — | [DATA_NEEDED: ESB count] |
| Dedicated Inputs | — | 4 |
| Nominal Core Supply Voltage (VCCINT) | — | 2.5 V |
| VCCINT Range | — | 2.375 V to 2.625 V |
| Gambaran Suhu Operasi | — | -40 °C to +100 °C |
| Package Type | — | S-PBGA-B784 (FineLine BGA) |
| Package Pin Count | — | 784 balls |
| Ball Pitch | — | 1.000 mm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Device Form Factor | — | Loadable PLD |
| Configuration Memory | — | SRAM-based (volatile) |