EP20K400FI784-3 vs EP20K400FC784-2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K400FI784-3 disebabkan oleh Intel dan EP20K400FC784-2 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP20K400FI784-3 | EP20K400FC784-2 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX 20K | APEX 20K |
| Typical Gate Count | 400,000 gates | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | 16,640 |
| Dedicated Inputs | 4 | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Supply Voltage (Nominal) | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| Speed Grade | -3 (slowest) | -2 (industrial) |
| Suhu Operasi | -40 °C to +100 °C (industrial) | [DATA_NEEDED: exact Tj range] |
| Kemasan | 784-ball PBGA (Fine-pitch BGA) | 784-Ball FineLine BGA (FC) |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.000 mm | — |
| Seated Height (max) | 2.7000 mm | — |
| Body Material | Plastic / Epoxy | — |
| Aras MSL | 3 | 3 (per Partstack listing) |
| Configuration Method | SRAM (external EPROM required) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Process Technology | 0.18 µm CMOS SRAM | 0.22 µm CMOS SRAM |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not confirmed in provided data] |
| Device Family Member | — | EP20K400C |
| Typical System Gates | — | 400,000 |
| Maximum User I/O Pins | — | 488 (784-BGA) |
| Embedded RAM (ESB) | — | 212 Kbits |
| Maximum Block RAM | — | [DATA_NEEDED: block RAM organization per ESB] |
| Maximum Frequency (internal) | — | [DATA_NEEDED: fmax, datasheet-dependent] |
| Core Voltage | — | 2.5 V |
| MultiVolt I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | — | Serial / Parallel SRAM-volatile (external PROM required) |
| Peak Reflow Temperature | — | 220 °C (per Partstack listing) |
| Hot Socketing | — | Supported |
| JTAG / Boundary-Scan | — | IEEE 1149.1 compliant |