EP20K400FI784-3 vs EP20K400FI784-1 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K400FI784-3 disebabkan oleh Intel dan EP20K400FI784-1 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP20K400FI784-3 | EP20K400FI784-1 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX 20K | APEX 20K |
| Typical Gate Count | 400,000 gates | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | 1,560 |
| Dedicated Inputs | 4 | 4 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | 488 |
| Supply Voltage (Nominal) | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| Speed Grade | -3 (slowest) | — |
| Suhu Operasi | -40 °C to +100 °C (industrial) | — |
| Kemasan | 784-ball PBGA (Fine-pitch BGA) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.000 mm | — |
| Seated Height (max) | 2.7000 mm | — |
| Body Material | Plastic / Epoxy | — |
| Aras MSL | 3 | — |
| Configuration Method | SRAM (external EPROM required) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 0.18 µm CMOS SRAM | 0.18 µm CMOS, 6-layer metal |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Series | — | EP20K400 |
| Device Type | — | Loadable PLD (FPGA-class) |
| Usable Gates | — | 400,000 |
| Embedded Memory (EAB RAM) | — | 212,992 bits |
| Maximum Internal Clock Frequency | — | 6.1 GHz |
| Package Type | — | 784-ball Fine-pitch BGA (S-PBGA-B784) |
| Suhu Hubungan Operasi | — | -40°C to +100°C (industrial 'I') |
| Supply Voltage - Core | — | 1.8 V |
| I/O Standards Supported | — | 3.3 V / 5 V PCI, LVTTL, LVCMOS |
| Boundary Scan | — | JTAG IEEE 1149.1 |
| Lead-Free / RoHS | — | [DATA_NEEDED: RoHS status] |