EP2A25F672I6 vs EP2A25F672I8 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672I6 disebabkan oleh Intel dan EP2A25F672I8 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2A25F672I6 EP2A25F672I8
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS 0.15 µm CMOS, up to 8 metal layers
Kemasan 672-ball FineLine BGA (FBGA-672) 672-ball FC-FBGA (FineLine BGA), 27 × 27 mm, 1 mm pitch
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 I8 (industrial, 8-speed-grade per APEX II ordering scheme)
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM —
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
Status RoHS [DATA_NEEDED: RoHS compliance status] unknown
Lead-Free [DATA_NEEDED: lead-free status] —
Aras MSL [DATA_NEEDED: moisture sensitivity level] —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Logic Elements / Cells — 24,320
Equivalent Gates — 900,000
Embedded Memory (RAM bits) — 622,592
User I/Os — 492
Number of PLLs — 4
Core Supply Voltage — 1.5 V
Propagation Delay — 1.69 ns (typical)
Internal Performance — 333 MHz (per legacy datasheet)
LVDS / High-Speed I/O — Yes, up to 1 Gbps
Suhu Operasi — –40 °C to +85 °C (industrial, 'I' grade)
JTAG / Boundary Scan — IEEE 1149.1 compliant
I/O Standards Supported — LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL, GTL+, PCI
Lead-Free Status — unknown

Laporan Datasheet & Sumber

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