EP2A40F672I-9 vs EP2A40F672I9 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A40F672I-9 disebabkan oleh Intel dan EP2A40F672I9 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A40F672I-9 | EP2A40F672I9 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Device | EP2A40 | — |
| Logic Elements | 38,400 | — |
| System Gates | 1,500,000 | 1.5 M |
| Maximum Operating Frequency | 366 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.15 µm CMOS |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) | — |
| Suhu Operasi | -40 °C to +100 °C (Industrial) | — |
| Kemasan | 672-pin FC-FBGA (Fine-pitch Ball Grid Array) | 672-pin FC-FBGA |
| Speed Grade | -9 | — |
| True-LVDS Channels | Yes (dedicated) | — |
| Embedded Memory | Dual-port RAM, single-port RAM, ROM, CAM (via ESBs) | — |
| Hot Socketing | Supported | — |
| Configuration Mode | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG | — |
| Moisture Sensitivity Level | MSL 3 | — |
| Peak Reflow Temperature | 220 °C | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements / Cells | — | 38,400 cells |
| Maximum Internal Frequency | — | 366 MHz |
| Core Supply Voltage | — | 1.5 V |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Operating Temperature Grade | — | Industrial (I) |
| Programming Interface | — | IEEE 1149.1 JTAG |
| Configuration Memory | — | SRAM-based, in-system programmable |
| Design Tool Support | — | Quartus / MAX+PLUS II |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Device Marking Suffix Decode | — | I = Industrial grade; 9 = speed grade 9 |