EP2A70F1508C9 vs EP2A70F1508C9N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A70F1508C9 disebabkan oleh Intel dan EP2A70F1508C9N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2A70F1508C9 | EP2A70F1508C9N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Series | APEX II | EP2A70 |
| Family | APEX II FPGA | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | 67200 |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | 4 |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Kemasan / Case | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Suhu Operasi | 0 °C to 85 °C | — |
| Speed Grade | C9 | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 um CMOS |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Unknown - legacy part, verify with supplier |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| System Gates | — | 3M |
| Embedded Memory Bits | — | 1146880 |
| Maximum User I/O | — | 1060 |
| Core Voltage | — | 1.5 V (1.425 V to 1.575 V) |
| Operating Frequency | — | 198 MHz |
| Package Type | — | 1508-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1508 |
| Operating Temperature Grade | — | Commercial |
| Configuration Method | — | JTAG, Passive Serial, Active Serial |
| JTAG (IEEE 1149.1) | — | Supported |