EP2A70F1508C9 vs EP2A70F1508I-8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A70F1508C9 disebabkan oleh Intel dan EP2A70F1508I-8 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2A70F1508C9 | EP2A70F1508I-8 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Series | APEX II | APEX II (EP2A) |
| Family | APEX II FPGA | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Kemasan / Case | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Suhu Operasi | 0 °C to 85 °C | -40C to +100C (Industrial) |
| Speed Grade | C9 | -8 |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | PS, PPS, PPA, JTAG |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Aras MSL | [DATA_NEEDED: MSL level] | 3 |
| Logic Elements | — | 70,000 (approx.) |
| Kemasan | — | 1508-ball FineLine BGA (FBGA-1508) |
| Configuration Memory | — | SRAM-based |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI |
| Embedded System Blocks (ESBs) | — | Yes (RAM/ROM/CAM) |
| On-chip PLLs | — | Yes |
| Tegangan Pemberi Arus | — | 1.8 V core (typical APEX II) |
| Peak Reflow Temperature | — | 220 C |
| Lead-free | — | [DATA_NEEDED: lead-free status] |
| MultiCore Interconnect | — | Yes |
| Design Software | — | Quartus II (APEX II support up to v13.0) |