EP2A70F1508I-9 vs EP2A70F1508C9N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A70F1508I-9 disebabkan oleh Intel dan EP2A70F1508C9N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2A70F1508I-9 - APEX II FPGA 70K LE, FBGA-1508 | Altera / Intel
EP2A70F1508I-9 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2A70F1508I-9 | EP2A70F1508C9N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | APEX II (EP2A) | APEX II |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Typical Gates | 70,000 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O] | — |
| Maximum User Memory Bits | [DATA_NEEDED: embedded RAM bits] | — |
| Kemasan | 1508-ball FBGA (FineLine BGA) | — |
| Process Technology | 0.18 um CMOS, SRAM-based | 0.15 um CMOS |
| Speed Grade | -9 (fastest APEX II speed grade) | — |
| Suhu Operasi | -40C to +100C (Industrial, suffix I) | — |
| Configuration Method | SRAM-based, in-system reprogrammable | JTAG, Passive Serial, Active Serial |
| On-chip Memory | Embedded System Blocks (ESBs) - dual-port RAM/ROM | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, LVPECL | — |
| Differential I/O | True-LVDS capable | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Tingkat sensitiviti Air Nama (MSL) | 3 | — |
| Peak Reflow Temperature | 220 C | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance per data] | Unknown - legacy part, verify with supplier |
| Design Software | Quartus II (legacy APEX II support) | — |
| Series | — | EP2A70 |
| Logic Elements / Cells | — | 67200 |
| System Gates | — | 3M |
| Embedded Memory Bits | — | 1146880 |
| Maximum User I/O | — | 1060 |
| Number of PLLs | — | 4 |
| Core Voltage | — | 1.5 V (1.425 V to 1.575 V) |
| Operating Frequency | — | 198 MHz |
| Package Type | — | 1508-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1508 |
| Jenis Pemasangan | — | Surface Mount |
| Operating Temperature Grade | — | Commercial |
| JTAG (IEEE 1149.1) | — | Supported |