EP2AGX260EF29C5G vs EP2AGX260EF29C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX260EF29C5G disebabkan oleh Intel dan EP2AGX260EF29C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX260EF29C5G | EP2AGX260EF29C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 260,000 | 244,188 |
| Total Memory Bits | 12,038,144 bits | — |
| Embedded RAM Bits | 244,188 bits | — |
| Number of LABs | 10,260 | — |
| User I/O Count | 372 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | 780-Ball FC-FBGA |
| Package Code | HBGA, 29 mm | — |
| Speed Grade | C5 (commercial -5C to 85C) | C5 (-5) |
| Process Node | 40 nm | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT nominal] | — |
| Transceivers | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] | — |
| DSP Blocks | 18x18 multipliers, count [DATA_NEEDED] | — |
| Suhu Operasi | 0C to 85C (commercial) | Commercial (0C to +85C) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (G suffix) | — |
| Aras MSL | [DATA_NEEDED] | [DATA_NEEDED: MSL level] |
| Adaptive Logic Modules (ALM) | — | 10260 LABs |
| Embedded Memory | — | 12,038,144 bits (12 Mbits) |
| Maximum User I/O | — | 372 |
| Process Technology | — | 40 nm TSMC |
| Core Supply Voltage | — | 0.9 V |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes (per RoHS compliance) |