EP2AGX260EF29C5G vs EP2AGX260EF29C6G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX260EF29C5G disebabkan oleh Intel dan EP2AGX260EF29C6G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX260EF29C5G | EP2AGX260EF29C6G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 260,000 | — |
| Total Memory Bits | 12,038,144 bits | — |
| Embedded RAM Bits | 244,188 bits | — |
| Number of LABs | 10,260 | — |
| User I/O Count | 372 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | 780-ball FC-FBGA |
| Package Code | HBGA, 29 mm | — |
| Speed Grade | C5 (commercial -5C to 85C) | -6 |
| Process Node | 40 nm | — |
| Supply Voltage - Core | [DATA_NEEDED: VCCINT nominal] | — |
| Transceivers | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] | [DATA_NEEDED: transceiver count] |
| DSP Blocks | 18x18 multipliers, count [DATA_NEEDED] | — |
| Suhu Operasi | 0C to 85C (commercial) | Commercial (0C to +85C) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (G suffix) | — |
| Aras MSL | [DATA_NEEDED] | [DATA_NEEDED: MSL rating] |
| Logic Elements | — | 244,188 |
| Embedded Memory (bits) | — | 12,038,144 |
| Embedded Multipliers (18x18) | — | 372 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| User I/O Banks | — | [DATA_NEEDED: bank count] |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O] |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |