EP2AGZ225FF35C3G vs EP2AGZ300FF35C3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ225FF35C3G disebabkan oleh Altera dan EP2AGZ300FF35C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ225FF35C3G | EP2AGZ300FF35C3G |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | — |
| Series | Arria II | Arria II GZ |
| Logic Elements (LE) | 225,000 | — |
| Kemasan | 1152-ball Flip-Chip BGA (FF35) | FCBGA-1152 (35 mm) |
| Package Size | 35 mm x 35 mm | — |
| Suhu Operasi | 0C to +85C (Commercial) | — |
| Speed Grade | C3 | 3 (mid-performance) |
| Transceivers | Up to 16 channels | 16 channels, up to 6.375 Gbps |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: count] | 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes |
| Embedded Memory | [DATA_NEEDED: Mbits] | 17,133 Kbit |
| User I/O Banks | [DATA_NEEDED: count] | — |
| Maximum User I/O | [DATA_NEEDED: pin count] | — |
| Process Technology | 40 nm TSMC | 40 nm TSMC |
| Memory Controller Support | DDR3, DDR2, QDR II+ | — |
| PCI Express Hard IP | Yes (Gen1/Gen2) | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Lead-Free | Yes | — |
| Logic Elements | — | 300,000 |
| Adaptive Logic Modules (ALMs) | — | 119,088 |
| Hard PCIe Controllers | — | Up to 12 (Gen2 endpoint/root-port) |
| User I/Os | — | 1,288 |
| I/O Banks | — | 12 |
| Package Family | — | BGA (Flip-Chip) |
| Temperature Grade | — | Commercial (0 C to 85 C junction) |
| Configuration Method | — | Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel |
| Hard Memory Controller | — | DDR3 up to 800 MHz, DDR2, QDR II+ |