EP2AGZ300FF35C3G vs EP2AGZ300FF35I4G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FF35C3G disebabkan oleh Intel dan EP2AGZ300FF35I4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2AGZ300FF35C3G EP2AGZ300FF35I4G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Arria II GZ Arria II GZ
Logic Elements 300,000 —
Adaptive Logic Modules (ALMs) 119,088 —
Embedded Memory 17,133 Kbit —
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes [DATA_NEEDED: DSP block count]
Transceivers 16 channels, up to 6.375 Gbps Up to 21 channels
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) PCIe Gen1 and Gen2
User I/Os 1,288 —
I/O Banks 12 —
Process Technology 40 nm TSMC —
Kemasan FCBGA-1152 (35 mm) 1152-FBGA (FF35) 35x35 mm
Package Family BGA (Flip-Chip) —
Temperature Grade Commercial (0 C to 85 C junction) —
Speed Grade 3 (mid-performance) 4
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel —
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ —
Status RoHS Compliant Compliant
Family Name — Arria II GZ FPGA
Logic Elements (LE) — 300,000
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Embedded Memory (Bits) — 18.16 Mbit
Maximum User I/O — 554
Transceiver Data Rate — 8.55 Gbps
Memory Interfaces — DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz
PLLs — Fractional PLLs on-chip
Suhu Operasi — -40C to +100C (Industrial, I4 grade)
Jenis Pemasangan — Surface Mount
Aras MSL — [DATA_NEEDED: MSL rating]
Process Node — 40 nm

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