EP2AGZ300HF40I3N vs EP2AGZ300HF40C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300HF40I3N disebabkan oleh Intel dan EP2AGZ300HF40C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300HF40I3N | EP2AGZ300HF40C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Arria II GZ | Arria II GZ |
| Family | EP2AGZ | — |
| Logic Elements (LE) | 298,000 | 298,000 |
| Embedded Memory Bits | 18,854,912 | — |
| User I/O Count | 734 | 734 |
| Kemasan | 1517-BBGA, FCBGA (HF40) | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage (Core) | 0.9 V | 0.9 V (typical) |
| Operating Temperature Grade | Industrial (-40C to +100C) | Commercial (C4) |
| Process Technology | 40 nm | — |
| Number of PLLs | 4 | — |
| Configuration Interface | Passive Serial / Fast Passive Parallel / JTAG | — |
| Bitstream Encryption | AES-256 | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory (bits) | — | 18,854,912 (~18.5 Mbit) |
| Number of LABs/CLBs | — | 1,194 |
| Package Type | — | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Package Code | — | HBGA |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: terminal pitch mm] |
| Process Node | — | 40 nm TSMC low-power |
| Transceiver Speed (max) | — | 6.375 Gbps |
| Number of Transceivers | — | Up to 28 (variant-dependent) |
| PLL Count | — | 12 |
| Hard PCIe Gen2 IP | — | Yes (x1/x2/x4/x8) |
| DDR3 Memory Controller Hard PHY | — | Yes |
| LVDS Support | — | Up to 1.4 Gbps |
| Design Software | — | Quartus II (13.0+ for Arria II GZ) |