EP2S130F1020C3 vs EP2S15F484C5 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S130F1020C3 disebabkan oleh Intel dan EP2S15F484C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2S130F1020C3 EP2S15F484C5
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Series Stratix II —
Family Stratix II Stratix II
Logic Elements / Cells 132,540 —
Logic Array Blocks (LABs) 6,627 —
User I/Os 742 —
Embedded Memory (TriMatrix) [DATA_NEEDED: total Mbits] —
DSP / Multiplier Blocks [DATA_NEEDED: DSP block count] —
Transceivers Logic-rich SKU (no transceiver; transceiver variants use different suffix) —
Maximum Internal Frequency 778.82 MHz (per family datasheet) —
Process Technology 90 nm —
Core Supply Voltage (VCCINT) 1.15 V to 1.25 V —
Kemasan / Case 1020-BBGA (FC-FBGA), 33x33 mm —
Supplier Device Package 1020-FBGA (33x33) —
Jenis Pemasangan Surface Mount Surface Mount
Suhu Operasi 0C to +85C (commercial, 'C' speed grade) —
Speed Grade C3 (commercial, -3 speed) —
Status RoHS [DATA_NEEDED: RoHS status] Non-Compliant (Contains Lead)
Aras MSL [DATA_NEEDED: MSL level] —
Logic Elements (LE) — 15,600
Adaptive Logic Modules (ALMs) — 6240
LABs / CLBs — 780
Embedded Memory — 409 Kbit (TriMatrix)
User I/O Count — 342
Number of Logic Cells — 15600
Supply Voltage (Core) — 1.2 V
Maximum Operating Frequency — 609.76 MHz
Kemasan — 484-ball FBGA (FC-FBGA)
Process Node — 90 nm
Operating Temperature Grade — Commercial (per DigiKey listing)
Configuration Method — SRAM-based (volatile, external config device)

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