EP2S180F1508C4TT vs EP2S180F1508C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1508C4TT disebabkan oleh Altera dan EP2S180F1508C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic
EP2S180F1508C4TT Obsolete
Pengandingan Spesifikasi
| Parametr | EP2S180F1508C4TT | EP2S180F1508C3 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Unknown |
| Product Type | Field-Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix II | — |
| Logic Elements | approximately 180,000 | [DATA_NEEDED: logic element count] |
| User I/O | 1,170 pins | — |
| Logic Array Blocks | 8,970 LABs | 8,970 LABs |
| Kemasan | 1,508-ball FBGA | 1508-BBGA, FCBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Temperature Grade | -T | — |
| Configuration Mechanism | [DATA_NEEDED: configuration mechanism] | — |
| Operating Voltage | [DATA_NEEDED: operating voltage] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage] | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature range] |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Typical Power Dissipation | [DATA_NEEDED: typical power dissipation] | — |
| Status RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | [DATA_NEEDED: AEC-Q100 status] |
| Lead-Free Status | unknown | — |
| Halogen-Free Status | unknown | — |
| Series | — | Stratix II |
| Gate Count | — | 180,000 gates |
| User I/Os | — | 1,170 I/Os |
| Tegangan Pemberi Arus | — | 1.15 V to 1.25 V |
| Supplier Device Package | — | 1508-FBGA (30x30 mm) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 1,508 |
| Package Code | — | BGA |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| Transceivers | — | [DATA_NEEDED: transceiver count and speed] |