EP2S30F484C3N vs EP2S30F484I4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S30F484C3N disebabkan oleh Intel dan EP2S30F484I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2S30F484C3N | EP2S30F484I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| FPGA Family | Stratix II | — |
| Number of Logic Elements/Cells | 33880 cells | — |
| Number of LABs | 1694 LABs | — |
| Total RAM Bits | 1369728 bits | — |
| Number of User I/Os | 342 | — |
| Core Supply Voltage | 1.2 V | — |
| Maximum Internal Frequency | 816.99 MHz | — |
| Technology Process | 90 nm CMOS | — |
| Kemasan / Case | 484-BBGA, FC-FBGA | — |
| Number of Ball Terminals | 484 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Embedded Memory Blocks | [DATA_NEEDED: exact M4K/M512/M-RAM block counts] | — |
| Embedded Multipliers | [DATA_NEEDED: number of 18x18 embedded multipliers] | — |
| Family | — | Stratix II |
| Logic Elements | — | 33,880 |
| Embedded Memory | — | 1,369,728 bits |
| User I/O Pins | — | 342 |
| Kemasan | — | 484-ball FineLine BGA (FBGA) |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 90 nm |
| Core Voltage | — | 1.2 V (refer to datasheet) |
| Operating Temperature Grade | — | Industrial -40C to +100C |
| Lead-Free / RoHS | — | Yes (N suffix indicates lead-free RoHS) |
| Speed Grade | — | 4 |
| On-Chip DSP Blocks | — | Yes (dedicated 9x9/18x18/36x36 multipliers) |
| PLLs | — | Yes (on-chip, refer to datasheet for count) |
| Configuration Method | — | Serial/parallel via Quartus II |