EP2SGX30CF780C6 vs EP2SGX30CF780C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30CF780C6 disebabkan oleh Intel dan EP2SGX30CF780C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel
EP2SGX30CF780C5 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX30CF780C6 | EP2SGX30CF780C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Kemasan | 780-ball FineLine BGA (F780) | 780-ball FBGA |
| Speed Grade | C6 (commercial, mid-speed) | -5 |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements | — | 33880 |
| Logic Array Blocks (LABs) | — | 1694 |
| Maximum User I/O Pins | — | 361 |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Jenis Pemasangan | — | Surface Mount |
| Transceivers | — | Multi-gigabit transceivers with embedded CDR |
| PLLs | — | 4 |
| Embedded Memory | — | M512 / M4K / M-RAM blocks (totals per datasheet) |
| DSP Blocks | — | Embedded multiplier/DSP blocks |