EP2SGX60EF1152C5 vs EP2SGX60EF1152I4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152C5 disebabkan oleh Intel dan EP2SGX60EF1152I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX60EF1152C5 EP2SGX60EF1152C5 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C5 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C5 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX60EF1152C5 EP2SGX60EF1152I4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Device Family Stratix II GX Stratix II GX
Logic Elements 60,440 60,440
LABs / CLBs 3,022 —
Total RAM Bits 2,544,192 —
Number of I/Os 534 —
Package Type 1152-FBGA —
Package Dimensions 35 x 35 mm 23 x 23 mm, 1 mm pitch (per data source)
Core Supply Voltage 1.15 V to 1.25 V 1.2 V
Internal Operating Frequency Up to 717 MHz —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Operating Temperature Grade Commercial (0C to +85C) —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Aras MSL [DATA_NEEDED: MSL moisture sensitivity level] —
User I/O Banks [DATA_NEEDED: number of I/O banks] —
Transceivers [DATA_NEEDED: number of integrated transceivers] —
Logic Cells — 60,440
Logic Array Blocks (LABs) — 3,022
Embedded Memory — 2,544,192 bits
User I/O Pins — 534
Maximum Internal Frequency — 717 MHz (per data source)
Maximum Operating Frequency — 732.1 MHz (per data source)
Process Technology — 90 nm CMOS
Kemasan — 1152-ball FC-FBGA (flip-chip fine-pitch BGA)
Temperature Grade — Industrial

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