EP2SGX60EF1152I3 vs EP2SGX60EF1152C5N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152I3 disebabkan oleh Intel dan EP2SGX60EF1152C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX60EF1152C5N EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel

EP2SGX60EF1152C5N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX60EF1152I3 EP2SGX60EF1152C5N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family Stratix II GX Stratix II GX
Series EP2SGX60 —
Logic Elements (LEs) 60,440 —
Adaptive Logic Modules (ALMs) 30,220 (estimated from LEs) —
Equivalent Logic Cells (CLBs) 60,440 —
Embedded Memory (Bits) 2,544,192 bits (per DigiKey listing for the I4N variant) —
Maximum Internal Frequency 717 MHz —
Combinational Delay (per CLB) 2.99 ns —
Multi-Gigabit Transceivers [DATA_NEEDED: exact count for EP2SGX60] —
Maximum Transceiver Data Rate 6.375 Gbps (per Stratix II GX family spec) —
Total RAM Bits 2,544,192 bits —
Kemasan 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch 1152-ball FC-FBGA
Pin/Ball Count 1152 —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (Flip-Chip BGA)
Suhu Operasi -40C to +100C (Industrial, I3 speed grade) Commercial (0C to +85C)
Speed Grade I3 (Industrial) -5 (mid)
Configuration Mode Enhanced (EPC) - fast parallel via external memory —
Process Technology 90 nm CMOS 90 nm CMOS
Status RoHS [DATA_NEEDED: not in retrieved snippets] [DATA_NEEDED: RoHS status]
Logic Elements (LE) — 60,440
Logic Array Blocks (LABs) — 3022
Embedded Memory Bits — 2,544,192
User I/O Count — 534
Core Voltage — 1.2 V
Maximum Operating Frequency — 609.76 MHz
Aras MSL — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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