EP2SGX90EF1152I3 vs EP2SGX90EF1152I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152I3 disebabkan oleh Intel dan EP2SGX90EF1152I4 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Bahagian terakhir untuk beliAltera
EP2SGX90EF1152I4 - Stratix II GX FPGA, 90K LE, 1152-BGA | Intel / Altera
EP2SGX90EF1152I4 NrndPengandingan Spesifikasi
| Parametr | EP2SGX90EF1152I3 | EP2SGX90EF1152I4 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Series | Stratix II GX | Stratix II |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | — |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (I4): -40C to +100C |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 90,960 |
| LABs/CLBs | — | 4,548 |
| Total Memory Bits | — | 4,520,448 |
| User I/O Count | — | 558 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 732.1 MHz |
| Kemasan | — | 1152-ball FC-FBGA |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Integrated Transceivers | — | Yes (multi-gigabit, Stratix II GX family feature) |