EP3C10F256I7N vs EP3C10F256C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C10F256I7N disebabkan oleh Intel dan EP3C10F256C6N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C10F256I7N | EP3C10F256C6N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Device Type | FPGA | — |
| Logic Elements (LE) | 10,320 | 10,320 |
| Logic Blocks | 10,320 | — |
| Embedded Memory | 423,936 bits | — |
| Total Memory Bits | 423,936 | 423,936 bits |
| Maximum User I/O | 182 | — |
| Embedded 18x18 Multipliers | 46 | 46 |
| PLLs | 2 | 2 |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | — |
| Kemasan | 256-LBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA-256) |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | -40C to +125C (Industrial) | — |
| Status RoHS | Compliant | Compliant (lead-free N suffix) |
| Lead Free | Yes | — |
| Aras MSL | 3 | — |
| Embedded Memory (M9K blocks) | — | 46 blocks x 9 Kbit |
| Maximum User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Process Node | — | 65 nm low power (TSMC) |
| Configuration Modes | — | JTAG, Active Serial (AS), Active Parallel (AP) |
| I/O Standards | — | LVTTL, LVCMOS, SSTL, LVDS, RSDS, mini-LVDS, PPDS |
| Operating Temperature (Commercial) | — | 0C to +85C (C6 speed grade, N = lead-free) |
| Core Voltage (VCCINT) | — | 1.2 V |
| Programming Tool | — | Intel Quartus II (Cyclone III device support) |