EP3C16F484C7N vs EP3C40F484C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C16F484C7N disebabkan oleh Intel dan EP3C40F484C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C16F484C7N | EP3C40F484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | Cyclone III | Cyclone III |
| Logic Elements | 15,408 | 39,600 |
| Embedded Memory | 504 Kbits (M9K blocks) | — |
| Embedded Multipliers | 56 (18x18) | — |
| PLLs | 4 | 4 |
| User I/O Pins | 346 | — |
| Process Technology | 65 nm TSMC low-power | 65 nm low-power |
| Core Voltage | 1.2 V (1.15 V to 1.25 V) | — |
| Kemasan | 484-ball FBGA | 484-FBGA (F484), 1.0 mm pitch |
| Speed Grade | -7 | — |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| Maximum Internal Frequency | 437.5 MHz | — |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL | LVDS, LVTTL, LVCMOS, SSTL, PCI |
| Configuration Method | JTAG (IEEE 1149.1), EPCS serial flash, Active Serial | — |
| Status RoHS | Compliant | Compliant (lead-free FBGA) |
| Total Memory Bits | — | 1,161,216 |
| Embedded 18x18 Multipliers | — | 126 |
| Global Clock Networks | — | 20 |
| User I/Os | — | 331 |
| Configuration Memory | — | SRAM-based |
| Jenis Pemasangan | — | Surface Mount |
| Aras MSL | — | 3 |