EP3C25F324C7N vs EP3C25F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C7N disebabkan oleh Intel dan EP3C25F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324C7N | EP3C25F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm low-power |
| Core Voltage | 1.2 V | — |
| Kemasan | 324-ball FBGA | 256-FBGA (FineLine BGA) |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Device Type | — | FPGA |
| Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| Core Supply Voltage | — | 1.2 V |
| Suhu Operasi | — | -40C to +125C |
| Speed Grade | — | 7 |
| PLLs | — | 4 general-purpose PLLs |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Hot Socketing | — | Supported |
| Configuration | — | SRAM-based, in-system programmable |