EP3C5U256I7N vs EP3C5U256C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5U256I7N disebabkan oleh Intel dan EP3C5U256C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5U256I7N | EP3C5U256C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | — |
| Logic Elements | 5,136 | 5,136 |
| Total RAM Bits | 423,936 | — |
| Maximum User I/O | 182 | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 2 | — |
| Global Clock Networks | 10 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm low-k copper | 60 nm low-power CMOS |
| Internal Operating Frequency | 437.5 MHz (max) | — |
| Kemasan | 256-ball UFBGA (UBGA) | 256-UBGA (Ultra FineLine BGA) |
| Suhu Operasi | -40C to +100C (industrial, speed grade I7) | — |
| I/O Banks | 8 | — |
| Configuration Modes | AS, AP, PS, JTAG | AS, PS, JTAG, Fast Passive Parallel |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | Cyclone III |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Speed Grade | — | C6 |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead Free / RoHS | — | Yes / Compliant |