EP3CLS200F484C8 vs EP3CLS200F484C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS200F484C8 disebabkan oleh Intel dan EP3CLS200F484C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS200F484C8 | EP3CLS200F484C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone III LS (low-power Cyclone III) | Cyclone® III LS |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 20,5056 (approx) | — |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | 8,211,456 bits (8.21 Mbit) |
| Embedded 18x18 Multipliers | 210 | — |
| PLLs | 4 | — |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS, low-leakage |
| Kemasan | 484-pin FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Security | Design encryption / bitstream AES | — |
| Suhu Operasi | 0C to +85C (commercial, 'C' suffix) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 198,464 |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count] |
| Embedded Multipliers (18x18) | — | 396 |
| User I/O Pins | — | 210 |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum Operating Frequency | — | 402 MHz (fabric) |
| Speed Grade | — | 8 (slowest) |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Bitstream Encryption | — | AES-128 (256-bit key via separate license) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |