EP3SE110F1152C4LN vs EP3SE110F1152C4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152C4LN disebabkan oleh Intel dan EP3SE110F1152C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE110F1152C4LN EP3SE110F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Masa Terakhir Dibeli
Family Stratix III E (Enhanced logic) Stratix III E
Manufacturer Intel (formerly Altera) —
Logic Elements (LE) 107,500 —
Logic Array Blocks (LAB) 4,300 —
Adaptive Logic Modules (ALM) Yes —
Embedded Memory (bits) 8,936,448 —
Maximum User I/O 744 —
Maximum Internal Clock Frequency 717 MHz —
Process Technology 65 nm 65 nm
Core Supply Voltage (VCCINT) 0.9 V nominal (0.86 V to 0.94 V) —
Suhu Operasi 0 C to 85 C (commercial) —
Kemasan 1152-pin FC-FBGA (BBGA) —
Jenis Pemasangan Surface Mount —
Device Type FPGA - Field Programmable Gate Array —
Configuration Method JTAG / serial / parallel flash —
Status RoHS Compliant Compliant
Logic Elements — 107,500
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
Core Voltage — 1.1 V
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

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