EP3SE260F1152C4LN vs EP3SE260F1152C4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4LN disebabkan oleh Intel dan EP3SE260F1152C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260F1152C4LN EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4LN ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260F1152C4LN EP3SE260F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family Stratix III E Stratix III
Logic Elements (LE) 255,000 255,000
Embedded Memory 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 10,200
User I/Os 744 —
Kemasan 1152-ball FC-BGA 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Process Technology 65 nm CMOS 65 nm CMOS (TSMC)
Core Voltage 0.9 V 1.1 V
Core Clock Speed 375 MHz (max) —
Transceiver Data Rate 717 MHz —
Speed Grade C4 C4 (slowest commercial grade)
Suhu Operasi 0C to +85C (commercial) Commercial (0C to +85C) - inferred from speed grade C4
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Aras MSL [DATA_NEEDED: MSL level] —
Status RoHS Compliant Compliant (per distributor listings)
Series — Stratix III E (Enhanced)
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)

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