EP3SE260F1517C4N vs EP3SE260F1517I4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C4N disebabkan oleh Intel dan EP3SE260F1517I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260F1517I4N EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260F1517C4N EP3SE260F1517I4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Series Stratix® III E Stratix III E
Family Field-Programmable Gate Array (FPGA) —
Logic Elements 255,000 255,000
Embedded Memory 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
Maximum User I/Os 976 —
Kemasan 1517-BBGA, FCBGA 1517-BBGA, FCBGA
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Suhu Operasi 0°C to 85°C -40 °C to +100 °C (Industrial)
Core Voltage 0.9 V 1.1 V
Process Node 65 nm —
Aras MSL [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL classification]
Lead Free [DATA_NEEDED: lead-free status] —
Status RoHS [DATA_NEEDED: RoHS status] —
Maximum Transceiver Data Rate 12.5 Gbps —
Embedded Memory Bits — 16,672,768 bits
Embedded Memory (M9K/M144K blocks) — [DATA_NEEDED: total Kbits and block count]
User I/O Pins — 976
Transceivers — [DATA_NEEDED: number of full-duplex channels]
Transceiver Data Rate — 600 Mbps to 6.375 Gbps
DSP Blocks — [DATA_NEEDED: number of 18x18 multipliers]
PLLs — [DATA_NEEDED: total PLL count]
Process Technology — TSMC 65 nm
Package Body Size — [DATA_NEEDED: mm x mm]
Operating Temperature Grade — Industrial (I4)
Lead-Free / RoHS — [DATA_NEEDED: explicit RoHS statement]

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