EP3SE260H780I3 vs EP3SE260H780C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780I3 disebabkan oleh Intel dan EP3SE260H780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE260H780I3 EP3SE260H780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Family Stratix III E —
Logic Elements 255,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 —
Embedded 18x18 Multipliers 384 —
User I/Os 488 488
Operating Frequency (logic) 500 MHz —
Operating Frequency (internal max) 800 MHz —
Process Technology 65 nm 40 nm CMOS
Core Voltage 1.1 V —
Kemasan 780-Ball FC-HFBGA / FCBGA 780-BBGA, FCBGA (H780)
Jenis Pemasangan Surface Mount Surface Mount
Tingkat sensitiviti Air Nama (MSL) 3 (168 Hours) [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Status RoHS Lead Free / Compliant Compliant (lead-free 'N' suffix)
Suhu Operasi -40C to +100C (Industrial) 0 °C to +85 °C (C grade, commercial)
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
Number of Pins / Balls — 780
Maximum Core Frequency — [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
Transceivers — [DATA_NEEDED: number of embedded transceivers and max data rate]
DSP Blocks — [DATA_NEEDED: number of DSP blocks and precision]
Configuration Method — SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

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