EP3SE50F780I3G vs EP3SE50F780I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780I3G disebabkan oleh Intel dan EP3SE50F780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE50F780I3N - Stratix III E FPGA, 47.5K Logic Elements, 780-FBGA | Intel
EP3SE50F780I3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE50F780I3G | EP3SE50F780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | — |
| DSP Blocks | 264 (18x18 multipliers) | — |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | — |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | TSMC 40 nm | 65 nm |
| Kemasan | 780-pin FC-FBGA (F780) 29x29 mm | 780-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Suhu Operasi | -40C to +100C (Industrial, I3) | — |
| Speed Grade | 3 | — |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | 3 | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 47,500 |
| Embedded Memory Bits | — | 5,760,000 bits |
| User I/O Pins | — | 488 |
| Operating Temperature Grade | — | Industrial |
| Configuration Interface | — | JTAG IEEE Std. 1149.1 (BST), Passive Serial, Fast Passive Parallel, Active Serial |
| Boundary-Scan Support | — | Yes (IEEE 1149.1) |
| Status Lingkungan Hidup | — | Last Time Buy (Stratix III family EOL announced) |
| Supply Type | — | Tray (per JAK Electronics listing) |