EP3SL200H780I4LN vs EP3SL200H780I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780I4LN disebabkan oleh Altera dan EP3SL200H780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780I4LN | EP3SL200H780I3N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III L (Low-Power) | Stratix III L |
| Manufacturer | Intel / Altera (now Intel PSG) | — |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Kemasan / Case | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | I4 (Industrial, mid-speed grade) | — |
| Status RoHS | RoHS Compliant (lead-free) | Compliant |
| Aras MSL | MSL 3 (168 Hours, per JEDEC J-STD-020) | — |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Logic Elements | — | 200,000 |
| RAM Bits | — | 10,901,504 |
| User I/O | — | 488 |
| Kemasan | — | 780-BBGA, FCBGA |
| Package Pin Count | — | 780 |
| Supply Voltage (Core) | — | 0.9 V |
| Technology | — | CMOS, 40 nm |
| Process Node | — | 40 nm |
| Number of Terminals | — | 780 |
| Case / Package Code | — | BGA-780 |
| Lead-Free | — | Yes |