EP3SL70F484C2 vs EP3SL70F484C4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F484C2 disebabkan oleh Intel dan EP3SL70F484C4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F484C2 | EP3SL70F484C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III L FPGA | Stratix III L |
| Logic Elements | 67,500 | — |
| Embedded Memory | 2,699,264 bits | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| User I/O Count | 296 | 296 |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | 65 nm | 65 nm |
| Maximum Core Frequency | 600 MHz | — |
| Package Type | 484-ball FC-FBGA (FineLine BGA) | — |
| Package Pin Count | 484 | — |
| Suhu Operasi | 0C to +85C (Commercial) | — |
| Speed Grade | C2 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Elements (LE) | — | 67,500 |
| Embedded Memory (Bits) | — | 2,699,264 |
| Operating Frequency (Max) | — | 375 MHz |
| Kemasan | — | 484-ball FC-FBGA (FBGA-484) |
| Aras MSL | — | 3 (168 hours) |
| Configuration Memory | — | SRAM-based |
| Operating Temperature Grade | — | Commercial (C4) |
| Lead-Free | — | Yes |
| Shipping Form | — | Tray |