EP3SL70F780C2N vs EP3SL70F780C2G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C2N disebabkan oleh Intel dan EP3SL70F780C2G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780C2N | EP3SL70F780C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L | Stratix III L |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | — |
| Embedded Memory Type | M9K blocks | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS, low-power variant | — |
| Core Voltage | 1.1 V | — |
| Maximum Logic Performance | 600 MHz | — |
| Kemasan | 780-ball FC-FBGA (FineLine BGA) | 780-ball FCBGA (FineLine BGA) |
| Package Pin Count | 780 | — |
| Speed Grade | C2 (commercial, -2 speed bin) | C2 (medium) |
| Operating Temperature Grade | N suffix - standard commercial/other | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (per DigiKey listing) | Compliant |
| Embedded Memory | — | 2,699,264 bits |
| User I/O Count | — | 488 |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Process Node | — | 40 nm low-power CMOS |
| Core Voltage (VCC) | — | 0.9 V |
| DSP Blocks | — | Yes (dedicated) |
| Memory Interfaces Supported | — | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | Gen1/Gen2 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| PLLs | — | Fractional PLLs |