EP3SL70F780C3 vs EP3SL70F780C3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C3 disebabkan oleh Intel dan EP3SL70F780C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780C3 | EP3SL70F780C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | EP3SL70 |
| Family | Stratix III | Stratix® III L |
| Logic Elements (LE) | 67,500 | — |
| Embedded Memory (bits) | 2,699,264 | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Number of Pins / Balls | 780 | — |
| Kemasan | 780-BBGA, FC-FBGA | 780-BBGA, FCBGA (29x29 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 65 nm | 40 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Maximum Internal Clock Frequency | 500 MHz | — |
| Gambaran Suhu Operasi | 0°C to 85°C (commercial) | — |
| Speed Grade | C3 | -3 |
| Design Software | Quartus II (last supported v13.1) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Elements | — | 67,500 |
| Embedded Memory | — | 2,699,264 bits |
| Number of I/O | — | 488 |
| Temperature Grade | — | Commercial (0C to +85C) |
| Voltage - Supply | — | 0.9 V, 1.1 V, 2.5 V |
| Aras MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| DSP Multipliers (18x18) | — | 384 |
| PLL Count | — | 4 |
| Global Clock Networks | — | 12 |
| Configuration Method | — | JTAG, Active Serial, Passive Serial |