EP4CE75F23I8L vs EP4CE40F23I8L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE75F23I8L disebabkan oleh Intel dan EP4CE40F23I8L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE75F23I8L | EP4CE40F23I8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 75,408 | — |
| Embedded Memory (bits) | 2,810,880 | — |
| Number of M9K Memory Blocks | 305 | — |
| Embedded 18x18 Multipliers | 274 | 113 |
| User I/O Pins | 292 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 292 | — |
| Kemasan | 484-ball FBGA | 484-ball FBGA, 23x23 mm, 1.0 mm pitch |
| Suhu Operasi | -40C to +85C (Industrial) | -40C to +100C (industrial) |
| Supply Voltage (Core) | 1.0 V / 1.2 V | — |
| I/O Standards Supported | LVDS, SSTL, HSTL, LVPECL, LVCMOS, LVTTL | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Process Node | 60 nm low-leakage | — |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 39,600 |
| Logic Array Blocks (LAB) | — | 2,475 |
| Embedded Memory | — | 1,161,216 bits (113 M9K blocks) |
| Maximum User I/Os | — | 328 |
| I/O Banks | — | 8 |
| Process Technology | — | 60 nm |
| Core Voltage | — | 1.0 V (0.97 V to 1.03 V) |
| Speed Grade | — | 8 (I8L, industrial) |